This is pretty cool.
This is the how-they-done-it paragraph. Essentially, they printed mechanical logic gates by taking advantage of a conductive filament that grows/shrinks as it heats and cools. Cool!
The conductive filament the researchers used is Electrifi by Multi3D, which is PLA combined with copper micro-particles. A segment printed in this filament is normally very conductive due to the densely-packed particles, but as temperature increases (beginning around 40° C) the polymer begins to soften and undergoes thermal expansion. This expansion separates the copper particles, causing a dramatic increase in electrical resistance as electrical pathways are disrupted. That’s pretty neat, but what really ties it together is that this behavior is self-resetting, and reversible. As long as the PLA isn’t straight up melted (that is to say, avoids going over about 150° C) then as the material cools it contracts and restores the conductive pathways to their original low-resistance state. Neat!