this post was submitted on 17 Jan 2025
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Hardware

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AMD to Build Zen 6 CCD on TSMC 3nm Process, Next-Gen cIOD and sIOD on 4nm (www.techpowerup.com)
submitted 13 hours ago by [email protected] to c/hardware
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[–] HorreC 1 points 8 hours ago (1 children)

I thought one of the major reasons for getting into chiplets was yields and that the I/O die didnt benefit from scaling it down any more?

[–] [email protected] 1 points 6 hours ago

I don't think it's that it doesn't benefit, but its benefits have little effect on performance. On Zen 4 the io die adds a constant 30W to the power usage (which is a huge portion of the total TDP) so maybe they want want to reclaim some of that

[–] [email protected] 2 points 13 hours ago (1 children)

AMD is rumored to be building its next-generation CCD (core complex die) that implements the "Zen 6" microarchitecture, on the 3 nm TSMC N3E foundry node.

I am surprised they are going twith TSMC N3E. One would think they would target one of the 2nm nodes. Or perhaps Zen 6 is coming to marketing in the next Either Zen 6 ~12 years?

[–] [email protected] 4 points 12 hours ago* (last edited 11 hours ago)

3nm came out last year, if 2 comes out this, after a year of apple hogging all the supply it will trickle down to Qualcomm+nvidia next year and everybody else in ~~2026~~ 2027. That's how it seems to go with new nodes.