this post was submitted on 21 Jan 2024
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Wouldn't RAM on die mean lower wafer yield?
This is about RAM on the package not RAM on the die. It honestly makes no sense why we don't have CPUs and RAM soldered to the motherboard right next to the CPU package. I love being able to change the stuff myself, but any reasonable repair shop could be doing that for you and we can have much higher performance than we currently have. It's not like there's really many viable options anyways. AMD has what four good CPUs intel has like two, and there's two good ram ICS.
Why would you think soldering would increase performance vs socketed at all much less provide "much higher performance"
If soldered was the only option ans 6 skud was enough for everyone everyone would have to buy very expensive hardware to increase one spec instead of smart people getting to mix match and upgrade.
The socket has big reductions in ram and pcie signal integrity. If you don't plan to change the CPU and motherboard separately soldering it would save money and the store could do it for you when you order both together.
Because it’s true. Soldering the memory right next to the CPU allows us to run the memory at a lower voltage and faster clock rate, while getting lower latency too. The LPDDR4/5X are designed based around these improvements. GPUs have been doing this forever too for the same reasons. It’s a huge upgrade in every way except upgradability, which is effectively eliminated.
I'd like to see non-synthetic benchmarks showing real world performance increase in otherwise as close as possible to identical systems
Can it not just be socketed next to the CPU?
We seem to socket CPUs just fine.
On an ATX motherboard maybe, but there would be no space on a laptop or ITX board.