this post was submitted on 08 Dec 2024
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Hardware

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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024 (www.tomshardware.com)
submitted 1 week ago by Alphane_Moon to c/hardware
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[โ€“] Alphane_Moon 5 points 1 week ago* (last edited 1 week ago) (1 children)

As I was reading this rather information dense piece (the part on Ruthenium interconnect required multiple re-readings for some reason), a strange thought came to my head.

I imagined a senior Intel executive having to explain this research to Trump (or even his senior advisors). How would you even summarize this in a concise (e.g. x3 bullet points) way while still emphasizing the importance of this research?

"Using "next gen" ruthenium instead of legacy copper for greatly improved semiconductor wiring and electricity distribution"

Something like that? ๐Ÿ˜€

[โ€“] Frozengyro 2 points 1 week ago

New thing better thing. Big money.