AlotOfReading

I couldn't find official dimensional accuracy specs for any formlabs machines except the 1, which lists 150um. Perhaps you're talking about the 3, which has a specified minimum spot size of 85um according to this paper. Where did they claim micron dimensional accuracy?

Wavelength has a very direct impact on the resolution you can print because it's an optical system. Under perfect conditions, it'll be diffraction limited, which is typically anywhere from several hundred nm to tens of microns. That's an ideal system though, you're actually going to be getting a dimensional accuracy somewhat above that in practice, probably tens to hundreds of um.

That's not how RF works. For one thing, microwaves run at 2.4GHz, which means they can't "see" physical features smaller than a few centimeters (to greatly oversimplify what's going on). The miniscule bubbles simply aren't a big factor.

Rather, what's happening is that the ceramic (probably the glaze if we're honest) has a higher cross section and/or lower specific heat than the food, especially when it's frozen. It absorbs more energy and heats up faster.

I would also expect far fewer and smaller bubbles with industrial slip casting ("pouring into a mold") than manual production.

TCP has been amended in backwards incompatible ways multiple times since 1993. See e.g. RFCs 5681, 2675, and 7323 as examples.

Plus, speaking TCP/IP isn't enough to let you to use the web, which is what most people think of when you say "Internet". That 1993 device is going to have trouble speaking HTTP/1.1 (or 1.0 if you're brave) to load even the most basic websites and no, writing the requests by hand doesn't count.

eGPUs aren't supported on Apple silicon.

1 Lakh, or 100k. It's a common way of writing numbers in India and South Asia, though it's a suspiciously large number of notes.

It's pretty unintuitive because we're not used to dealing with ocean sized bodies of water in day to day life. Part of the explanation is just that the prevailing winds pile all the water in the Pacific up against the coast, causing higher sea levels on the West Coast. The lower salinity of the Pacific also causes lower water density, which translates to higher sea levels.

I haven't explained what the differences are because almost everything is different. It's like comparing a Model T to a Bugatti. They're simply not built the same way, even if they both use internal combustion engines and gearboxes.

Let me give you an overview of how the research pipeline occurs though. First is the fundamental research, which outside of semiconductors is usually funded by public sources. This encompasses things like methods of crack formation in glasses, better solid state models, improved error correction algorithms and so on. The next layer up is applied research, where the fundamental research is applied to improve or optimize existing solutions / create new partial solutions to unsolved problems. Funding here is a mix of private and public depending on the specific area. Semiconductor companies do lots of their own original research here as well, as you can see from these Micron and TSMC memory research pages. It's very common for researchers who are publicly funded here to take that research and use it to go start a private company, usually with funding from their institution. This is where many important semiconductor companies have their roots, including TSMC via ITRI. These companies in turn invest in product / highly applied research aimed at productizing the research for the mass market. Sometimes this is easy, sometimes it's extremely difficult. Most of the challenges of EUV lithography occurred here, because going from low yield academic research to high yield commercial feasibility was extremely difficult. Direct investment here is almost always private, though there can be significant public investments through companies. If this is published (it often isn't), it's commonly done as patents. Every company you've heard of has thousands of these patents, and some of the larger ones have tens or hundreds of thousands. All of that is the result of internal research. Lastly, they'll take all of that, build standards (e.g. DDR5, h.265, 5G), and develop commercial implementations that actually do those things. That's what OEMs buy (or try to develop on their own in the case of Apple modems) to integrate into their products.

You have no idea how modern technology is produced. Any particular product is usually the result of dozens to thousands of iterations, some funded with public money and many not. Let's take an example from your chart: DRAM. I actually don't know when DARPA "developed" DRAM (since DARPA usually funds private companies to do development for them), but it must have been before 1970 when Intel designed the 1103 chip that got them started. Do you think that pre-1970s design is remotely similar to the DRAM operating on your device today? I'll give you a hint: it's not.

And no, modern device development does not consist of gluing a bunch of APIs together. Apple maintains its own compilers, languages, toolchains, runtimes, hardware, operating systems, debugging tools, and so on. Some of that code had distant origins in open source (e.g. webkit), but that's vastly different than publicly funded and those components are usually very different today.

They're failing to produce competitive modems because modern wireless is one of closest things humans have to straight up black magic. It's extremely difficult to get right, especially as frequencies go up, SNR goes down, and we try to push things ever faster despite having effectively reached the Shannon limit ages ago.

Cost of living isn't the same everywhere and perspective is relative.

Rent in my area averages around 3k USD/mo for fairly plain arrangements. Between that and "unavoidable" costs like utilities, you'd get 3-4 months max on that amount, even living frugally. It really isn't that much for a lot of people, even if that amount might be to you.

Apple was one of the major contributors to the USB-C standard, including the physical connectors.

The tongue design was used because it makes high speed a lot easier. If your traces are in the center of the connector, you can do a cutout of the PCB and mount a "dumb" connector housing for the socket. You can also have a ground plane right in the middle and use both sides for differential pairs, which is exactly what happened. It also means you don't have to deal with the pain of high frequency signals leaving the board into the air like other connectors.

But yes, don't shove screwdrivers into your USB sockets either.

• Banana leaves will work fine if they're more accessible. It's a common substitute in other countries. You might even be able to use paper, really. It just has to keep everything contained during cooking/storage.

• Masa is basically just nixtamalized cornmeal/cornflour mixed with water. You can make nixtamalized corn yourself if you're willing to go through the effort. If you don't, unnixtmalized cornflour works. It's not bad, just different.

• Where does milk come into tamales?! Unless you're doing sweet tamales or trying to make cheese, tamales don't involve milk.

• Any chili will work, even thai. Add some capsicum if you want more of that pepper sweetness but all you can find for heat are small thais. Alternatively, use a recipe intended for chiltepins or pequin chilis. Mexico has hundreds of different chilis and all of them are used to make salsa. Just make sure to use white onion, not sweet or yellow. Throw everything in an oven till it's blackened, add cilantro/coriander, blend, season, cool, eat.