this post was submitted on 20 May 2024
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[–] [email protected] 3 points 7 months ago
  1. It removes the oxide layer from existing surfaces so the solder sticks and flows better
  2. It increases surface tension of the liquid solder so you get a nice round shape and no whiskers and less bridges
  3. It helps distribute the heat a bit. It works a little bit like thermal paste, especially when the contact area between the tip and the pad/component is very small.

Generally, flux is your friend and soldering without flux is terrible.